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Samsung ropes in former TSMC semiconductor engineer
15 days ago | By Android Headlines
Samsung has reportedly hired a veteran semiconductor engineer who worked for its foundry arch-rival TSMC for almost two decades. Lin Jun-cheng will serve the Korean firm as the senior vice president of the advanced semiconductor packaging team. He will oversee the development of cutting-edge packaging technology.
According to the Korean media, Lin is an expert in semiconductor packaging. He has an experience of more than 20 years in this field. He worked for TSMC from 1999 to 2017 and is credited to have played a pivotal role in laying the groundwork for 3D packaging technology, something...
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